Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Processing Through Glass Via (TGV) Interposers for Advanced Packaging
Processing Through Glass Via (TGV) Interposers for Advanced Packaging
Charles Woychik, John Lauffer, David Bajkowski, Michael Gaige, Robert Edwards, Gordon Benninger, William Wilson,
Woychik, Charles, John Lauffer, David Bajkowski, Michael Gaige, Robert Edwards, Gordon Benninger, and William Wilson. 2018. “Processing Through Glass Via (TGV) Interposers for Advanced Packaging.” IMAPSource Proceedings 2018 (1): 264–69. https://doi.org/10.4071/2380-4505-2018.1.000264.