Processing Through Glass Via (TGV) Interposers for Advanced Packaging

Charles Woychik; John Lauffer; David Bajkowski; Michael Gaige; Robert Edwards; Gordon Benninger; William Wilson

doi:10.4071/2380-4505-2018.1.000264

Loading [Contrib]/a11y/accessibility-menu.js

Woychik, Charles, John Lauffer, David Bajkowski, Michael Gaige, Robert Edwards, Gordon Benninger, and William Wilson. 2018. “Processing Through Glass Via (TGV) Interposers for Advanced Packaging.” IMAPSource Proceedings 2018 (1): 264–69. https://doi.org/10.4071/2380-4505-2018.1.000264.

View more stats