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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Modular Microsystems with Embedded Components
Christian Boehme
,
Andreas Ostmann
,
Martin Schneider-Ramelow
,
Embedding
Microsystem
Modular
Packaged Components
•
https://doi.org/10.4071/isom-2013-WP52
IMAPSource Conference Papers
Boehme, Christian, Andreas Ostmann, and Martin Schneider-Ramelow. 2013. “Modular Microsystems with Embedded Components.”
IMAPSource Proceedings
2013 (1): 735–39.
https://doi.org/10.4071/isom-2013-WP52
.
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