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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

Effective Inspection Methods for Advanced Packaging Technologies

Julia Brueckner, Michael Schwander, Moritz Jurgschat, Ramon Tuason,
Spectral Coherence Interferometry (SCI) Epoxy Mold Compound (EMC) Fan-Out Packaging Redistribution Layer (RDL) Optical Metrology Total Thickness Variation (TTV)
• https://doi.org/10.4071/isom-2017-THA32_055
IMAPSource Conference Papers
Brueckner, Julia, Michael Schwander, Moritz Jurgschat, and Ramon Tuason. 2017. “Effective Inspection Methods for Advanced Packaging Technologies.” IMAPSource Proceedings 2017 (1): 563–68. https://doi.org/10.4071/isom-2017-THA32_055.
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