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Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
Effective Inspection Methods for Advanced Packaging Technologies
Julia Brueckner
,
Michael Schwander
,
Moritz Jurgschat
,
Ramon Tuason
,
Spectral Coherence Interferometry (SCI)
Epoxy Mold Compound (EMC)
Fan-Out Packaging
Redistribution Layer (RDL)
Optical Metrology
Total Thickness Variation (TTV)
•
https://doi.org/10.4071/isom-2017-THA32_055
IMAPSource Conference Papers
Brueckner, Julia, Michael Schwander, Moritz Jurgschat, and Ramon Tuason. 2017. “Effective Inspection Methods for Advanced Packaging Technologies.”
IMAPSource Proceedings
2017 (1): 563–68.
https://doi.org/10.4071/isom-2017-THA32_055
.
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