Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Prospects for automotive SiP modules applying IC assembly and packaging technology
Prospects for automotive SiP modules applying IC assembly and packaging technology
Furukawa, Tomohiro, Takahiro Kasuga, Masato Umehara, and Yuka Tamadate. 2019. “Prospects for Automotive SiP Modules Applying IC Assembly and Packaging Technology.” IMAPSource Proceedings 2019 (1): 6–12. https://doi.org/10.4071/2380-4505-2019.1.000006.