Prospects for automotive SiP modules applying IC assembly and packaging technology

Tomohiro Furukawa; Takahiro Kasuga; Masato Umehara; Yuka Tamadate

doi:10.4071/2380-4505-2019.1.000006

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Furukawa, Tomohiro, Takahiro Kasuga, Masato Umehara, and Yuka Tamadate. 2019. “Prospects for Automotive SiP Modules Applying IC Assembly and Packaging Technology.” IMAPSource Proceedings 2019 (1): 6–12. https://doi.org/10.4071/2380-4505-2019.1.000006.

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