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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Moldflow simulation of an exposed pad leaded package
Vibhash Jha
,
Torsten Hauck
,
Moldflow simulation
leaded package EMC filling
void estimates
•
https://doi.org/10.4071/isom-2015-TP65
IMAPSource Conference Papers
Jha, Vibhash, and Torsten Hauck. 2015. “Moldflow Simulation of an Exposed Pad Leaded Package.”
IMAPSource Proceedings
2015 (1): 179–84.
https://doi.org/10.4071/isom-2015-TP65
.
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