A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive

Mary Liu; Wusheng Yin

doi:10.4071/isom-2011-WA2-Paper3

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Liu, Mary, and Wusheng Yin. 2011. “A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive.” IMAPSource Proceedings 2011 (1): 509–15. https://doi.org/10.4071/isom-2011-WA2-Paper3.

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