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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive
Mary Liu
,
Wusheng Yin
,
Room Temperature
Jetable
Solder Joint
Encapsulant
Adhesive
•
https://doi.org/10.4071/isom-2011-WA2-Paper3
IMAPSource Conference Papers
Liu, Mary, and Wusheng Yin. 2011. “A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive.”
IMAPSource Proceedings
2011 (1): 509–15.
https://doi.org/10.4071/isom-2011-WA2-Paper3
.
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