Vol. 2011, Issue 1, 2011January 01, 2011 EDT
A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive
A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive
Liu, Mary, and Wusheng Yin. 2011. “A First Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive.” IMAPSource Proceedings 2011 (1): 509–15. https://doi.org/10.4071/isom-2011-WA2-Paper3.