Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materials
Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materials
Mathew, Varughese, and Sheila Chopin. 2015. “Corrosion Reliability of Copper Wirebond (CuWB) Packages-Impact of Voltage and Corrosive Ions from Packaging Materials.” IMAPSource Proceedings 2015 (1): 286–91. https://doi.org/10.4071/isom-2015-WA51.