Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Optoelectronic Substrate With High-Aspect-Ratio Optical Through-Hole for Chip-to-Chip Interconnects
Optoelectronic Substrate With High-Aspect-Ratio Optical Through-Hole for Chip-to-Chip Interconnects
Atsushi Suzuki, Yutaka Takagi, Toshikazu Horio, Toshifumi Kojima, Toshikatsu Takada, Satoshi Iio, Masahiko Okuyama,
Suzuki, Atsushi, Yutaka Takagi, Toshikazu Horio, Toshifumi Kojima, Toshikatsu Takada, Satoshi Iio, and Masahiko Okuyama. 2011. “Optoelectronic Substrate With High-Aspect-Ratio Optical Through-Hole for Chip-to-Chip Interconnects.” IMAPSource Proceedings 2011 (1): 837–44. https://doi.org/10.4071/isom-2011-WP5-Paper5.