Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Interconnect and Packaging Techniques for System Integration of High Power Assemblies that Improve Assembly Efficiency and Design Flexibility
Interconnect and Packaging Techniques for System Integration of High Power Assemblies that Improve Assembly Efficiency and Design Flexibility
Lynch, Joseph, Richard Schneider, and Andy Longford. 2014. “Interconnect and Packaging Techniques for System Integration of High Power Assemblies That Improve Assembly Efficiency and Design Flexibility.” IMAPSource Proceedings 2014 (1): 763–68. https://doi.org/10.4071/isom-WP55.
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