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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Bonding Technologies for 3D integration
Sascha Lohse
,
Alexander Wollanke
,
3D packaging
Cu-Cu thermo compression
eutectic bonding
metal-diffusion-bonding
•
https://doi.org/10.4071/isom-2015-WA24
IMAPSource Conference Papers
Lohse, Sascha, and Alexander Wollanke. 2015. “Bonding Technologies for 3D Integration.”
IMAPSource Proceedings
2015 (1): 231–34.
https://doi.org/10.4071/isom-2015-WA24
.
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