Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications

M. Ekpu; R. Bhatti; M.I. Okereke; K.C. Otiaba

doi:10.4071/isom-2013-WA23

Ekpu, M., R. Bhatti, M.I. Okereke, and K.C. Otiaba. 2013. “Fatigue Life Analysis of Sn96.5Ag3.0Cu0.5 Solder Thermal Interface Material of a Chip-Heat Sink Assembly in Microelectronic Applications.” IMAPSource Proceedings 2013 (1): 473–77. https://doi.org/10.4071/isom-2013-WA23.

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Fatigue life analysis of Sn96.5Ag3.0Cu0.5 solder thermal interface material of a chip-heat sink assembly in microelectronic applications

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