Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Integrated Passive Devices and TSV, a disruptive technology for miniaturization
Integrated Passive Devices and TSV, a disruptive technology for miniaturization
Bunel, C., J-R. Tenailleau, F. Voiron, S. Borel, and A. Lefevre. 2013. “Integrated Passive Devices and TSV, a Disruptive Technology for Miniaturization.” IMAPSource Proceedings 2013 (1): 794–98. https://doi.org/10.4071/isom-2013-THP12.