Integrated Passive Devices and TSV, a disruptive technology for miniaturization

C. Bunel; J-R. Tenailleau; F. Voiron; S. Borel; A. Lefevre

doi:10.4071/isom-2013-THP12

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Bunel, C., J-R. Tenailleau, F. Voiron, S. Borel, and A. Lefevre. 2013. “Integrated Passive Devices and TSV, a Disruptive Technology for Miniaturization.” IMAPSource Proceedings 2013 (1): 794–98. https://doi.org/10.4071/isom-2013-THP12.

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