Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages

Schmaltz, Brian, Yukinari Abe, and Kazuyuki Kohara. 2014. “Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages.” IMAPSource Proceedings 2014 (1): 247–50. https:/​/​doi.org/​10.4071/​isom-TP32.