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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages
Brian Schmaltz
,
Yukinari Abe
,
Kazuyuki Kohara
,
Flip chip
underfill
low-K dielectric
warpage
delamination
fem
fea
lead free
cu pillar
•
https://doi.org/10.4071/isom-TP32
IMAPSource Conference Papers
Schmaltz, Brian, Yukinari Abe, and Kazuyuki Kohara. 2014. “Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages.”
IMAPSource Proceedings
2014 (1): 247–50.
https://doi.org/10.4071/isom-TP32
.
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