Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages

Brian Schmaltz; Yukinari Abe; Kazuyuki Kohara

doi:10.4071/isom-TP32

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Schmaltz, Brian, Yukinari Abe, and Kazuyuki Kohara. 2014. “Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages.” IMAPSource Proceedings 2014 (1): 247–50. https://doi.org/10.4071/isom-TP32.

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