Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages
Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages
Schmaltz, Brian, Yukinari Abe, and Kazuyuki Kohara. 2014. “Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages.” IMAPSource Proceedings 2014 (1): 247–50. https://doi.org/10.4071/isom-TP32.