Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates

Burton Carpenter; Betty Yeung; Yuan Yuan

doi:10.4071/isom-2013-WA31

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Carpenter, Burton, Betty Yeung, and Yuan Yuan. 2013. “Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates.” IMAPSource Proceedings 2013 (1): 486–91. https://doi.org/10.4071/isom-2013-WA31.

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