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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Fatigue Cycling of Electrical Interconnects Dispensed on Flexible Substrate

Mohammed Alhendi, Jack P. Lombardi, Guvinder S. Khinda, Maan Z. Kokash, Darshana L. Weerawarne, Peter Borgesen, Mark D. Poliks, Nancy C. Stoffel, Joe Iannotti,
Flexible printed electronicsDispensingFatigue cyclingReliability analysisSilver pastes
https://doi.org/10.4071/2380-4505-2018.1.000543
IMAPSource Conference Papers
Alhendi, Mohammed, Jack P. Lombardi, Guvinder S. Khinda, Maan Z. Kokash, Darshana L. Weerawarne, Peter Borgesen, Mark D. Poliks, Nancy C. Stoffel, and Joe Iannotti. 2018. “Fatigue Cycling of Electrical Interconnects Dispensed on Flexible Substrate.” IMAPSource Proceedings 2018 (1): 543–48. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000543.
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