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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Investigation of the Defect Size and Density in Thin SiON Filmfor Organic Device Encapsulation

Kunmo Chu, Ki Deok Bae, Byong Gwon Song, Yong Young Park, Jaekwan Kim, Wenxu Xianyu, Chang Seung Lee,
Thin-film encapsulation (TFE)ElectroplatingSiON
https://doi.org/10.4071/isom-2016-WP15
IMAPSource Conference Papers
Chu, Kunmo, Ki Deok Bae, Byong Gwon Song, Yong Young Park, Jaekwan Kim, Wenxu Xianyu, and Chang Seung Lee. 2016. “Investigation of the Defect Size and Density in Thin SiON Filmfor Organic Device Encapsulation.” IMAPSource Proceedings 2016 (1): 272–76. https:/​/​doi.org/​10.4071/​isom-2016-WP15.
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