Evaluation about Solder-IMC Crack of Fine Pitch BGA Package

Kang, Taeho, Ara Lee, Jaewoo Jeong, and Dongok Kwak. 2015. “Evaluation about Solder-IMC Crack of Fine Pitch BGA Package.” IMAPSource Proceedings 2015 (1): 147–50. https:/​/​doi.org/​10.4071/​isom-2015-TP54.