Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Evaluation about Solder-IMC Crack of Fine Pitch BGA Package
Evaluation about Solder-IMC Crack of Fine Pitch BGA Package
Kang, Taeho, Ara Lee, Jaewoo Jeong, and Dongok Kwak. 2015. “Evaluation about Solder-IMC Crack of Fine Pitch BGA Package.” IMAPSource Proceedings 2015 (1): 147–50. https://doi.org/10.4071/isom-2015-TP54.