Evaluation about Solder-IMC Crack of Fine Pitch BGA Package

Taeho Kang; Ara Lee; Jaewoo Jeong; Dongok Kwak

doi:10.4071/isom-2015-TP54

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Kang, Taeho, Ara Lee, Jaewoo Jeong, and Dongok Kwak. 2015. “Evaluation about Solder-IMC Crack of Fine Pitch BGA Package.” IMAPSource Proceedings 2015 (1): 147–50. https://doi.org/10.4071/isom-2015-TP54.

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