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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Evaluation about Solder-IMC Crack of Fine Pitch BGA Package
Taeho Kang
,
Ara Lee
,
Jaewoo Jeong
,
Dongok Kwak
,
CTE mismatch
buried via
FBGA
solder-IMC crack
solder joint reliability
•
https://doi.org/10.4071/isom-2015-TP54
IMAPSource Conference Papers
Kang, Taeho, Ara Lee, Jaewoo Jeong, and Dongok Kwak. 2015. “Evaluation about Solder-IMC Crack of Fine Pitch BGA Package.”
IMAPSource Proceedings
2015 (1): 147–50.
https://doi.org/10.4071/isom-2015-TP54
.
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