Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:29378/feed
Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Optimization of Ag Composition in Cu Pillar Bumps with Sn-xAg Solders

Moon Gi Cho, Hwan Sik Lim, Sun Hee Park, Yong Hwan Kwon, Jaesik Chung, Jinho Choi, Eun-Chul Ahn,
Cu Pillar BumpSn-Ag Pb-free SoldersIntermetallic CompoundUndercoolingThermodynamics
https://doi.org/10.4071/isom-2012-WP42
IMAPSource Conference Papers
Cho, Moon Gi, Hwan Sik Lim, Sun Hee Park, Yong Hwan Kwon, Jaesik Chung, Jinho Choi, and Eun-Chul Ahn. 2012. “Optimization of Ag Composition in Cu Pillar Bumps with Sn-xAg Solders.” IMAPSource Proceedings 2012 (1): 906–11. https:/​/​doi.org/​10.4071/​isom-2012-WP42.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system