Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Optimization of Ag Composition in Cu Pillar Bumps with Sn-xAg Solders
Optimization of Ag Composition in Cu Pillar Bumps with Sn-xAg Solders
Cho, Moon Gi, Hwan Sik Lim, Sun Hee Park, Yong Hwan Kwon, Jaesik Chung, Jinho Choi, and Eun-Chul Ahn. 2012. “Optimization of Ag Composition in Cu Pillar Bumps with Sn-xAg Solders.” IMAPSource Proceedings 2012 (1): 906–11. https://doi.org/10.4071/isom-2012-WP42.