Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu Solder Joints
Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu Solder Joints
Kim, S. H., and Jin Yu. 2010. “Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu Solder Joints.” IMAPSource Proceedings 2010 (1): 294–97. https://doi.org/10.4071/isom-2010-TP4-Paper2.