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Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Design and Process Implementation for Embedding Components

Vern Solberg,
embedded components build-up PCB multi-layer flip-chip micro-via
• https://doi.org/10.4071/isom-2011-TP3-Paper1
IMAPSource Conference Papers
Solberg, Vern. 2011. “Design and Process Implementation for Embedding Components.” IMAPSource Proceedings 2011 (1): 279–85. https://doi.org/10.4071/isom-2011-TP3-Paper1.
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