Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:24211/feed
Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric Efficiency

Michael Vincent, Doug Mitchell, Jason Wright, Yap Weng Foong, Alan Magnus, Zhiwei (Tony) Gong, Scott Hayes, Navjot Chhabra,
3DFan-Out Wafer Level Package (FO-WLP)heterogeneous integrationlow profilepackage stackingRedistributed Chip Package (RCP)reliabilityside connectSystem-in-Package (SiP)
https://doi.org/10.4071/isom-2013-WA14
IMAPSource Conference Papers
Vincent, Michael, Doug Mitchell, Jason Wright, Yap Weng Foong, Alan Magnus, Zhiwei (Tony) Gong, Scott Hayes, and Navjot Chhabra. 2013. “3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric Efficiency.” IMAPSource Proceedings 2013 (1): 447–51. https:/​/​doi.org/​10.4071/​isom-2013-WA14.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system