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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Reliability Modeling to Enable Damage Assessments for Plated Through Holes
Gilad Sharon
,
Donald Barker
,
Plated Through Hole (PTH)
Printed Circuit Board (PCB)
reliability
hysteresis
reflow cycles
lead-free electronics
finite element modeling
•
https://doi.org/10.4071/isom-2010-TA2-Paper5
IMAPSource Conference Papers
Sharon, Gilad, and Donald Barker. 2010. “Reliability Modeling to Enable Damage Assessments for Plated Through Holes.”
IMAPSource Proceedings
2010 (1): 59–65.
https://doi.org/10.4071/isom-2010-TA2-Paper5
.
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