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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Reliability Modeling to Enable Damage Assessments for Plated Through Holes

Gilad Sharon, Donald Barker,
Plated Through Hole (PTH)Printed Circuit Board (PCB)reliabilityhysteresisreflow cycleslead-free electronicsfinite element modeling
https://doi.org/10.4071/isom-2010-TA2-Paper5
IMAPSource Conference Papers
Sharon, Gilad, and Donald Barker. 2010. “Reliability Modeling to Enable Damage Assessments for Plated Through Holes.” IMAPSource Proceedings 2010 (1): 59–65. https:/​/​doi.org/​10.4071/​isom-2010-TA2-Paper5.
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