Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First Benefits
Chip-last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First Benefits
Kumbhat, Nitesh, Fuhan Liu, Venky Sundaram, Vivek Sridharan, Abhishek Choudhury, Hunter Chan, and Rao Tummala. 2010. “Chip-Last Embedded Actives and Passives in Ultra-Miniaturized Organic Packages with Chip-First Benefits.” IMAPSource Proceedings 2010 (1): 537–42. https://doi.org/10.4071/isom-2010-WP1-Paper1.