Vol. 2014, Issue 1, 2014January 01, 2014 EDT
PMV (Plating Mold Via) interconnection development in molded SiP modules
PMV (Plating Mold Via) interconnection development in molded SiP modules
Yoo, Do-Jae, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi, et al. 2014. “PMV (Plating Mold Via) Interconnection Development in Molded SiP Modules.” IMAPSource Proceedings 2014 (1): 777–82. https://doi.org/10.4071/isom-THP11.