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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

PMV (Plating Mold Via) interconnection development in molded SiP modules

Do-Jae Yoo, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi, Ki-Chan Kim, Il-Hyeong Lee, Tae-Sung Kang, Peter Lim,
Plating Mold Via (PMV) Mold Via Interconnection Advanced Packaging POP SiP
• https://doi.org/10.4071/isom-THP11
IMAPSource Conference Papers
Yoo, Do-Jae, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi, et al. 2014. “PMV (Plating Mold Via) Interconnection Development in Molded SiP Modules.” IMAPSource Proceedings 2014 (1): 777–82. https://doi.org/10.4071/isom-THP11.
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