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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur compounds
Varughese Mathew
,
Sheila Chopin
,
Copper wirebond
mold compounds
high temperature reliability
corrosion
electronic package
•
https://doi.org/10.4071/isom-WA42
IMAPSource Conference Papers
Mathew, Varughese, and Sheila Chopin. 2014. “High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur Compounds.”
IMAPSource Proceedings
2014 (1): 477–82.
https://doi.org/10.4071/isom-WA42
.
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