Vol. 2014, Issue 1, 2014January 01, 2014 EDT
High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur compounds
High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur compounds
Mathew, Varughese, and Sheila Chopin. 2014. “High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur Compounds.” IMAPSource Proceedings 2014 (1): 477–82. https://doi.org/10.4071/isom-WA42.