High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur compounds

Varughese Mathew; Sheila Chopin

doi:10.4071/isom-WA42

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Mathew, Varughese, and Sheila Chopin. 2014. “High Temperature Reliability of Copper Wire - Bonded Packages Encapsulated with Mold Compounds Containing Sulfur Compounds.” IMAPSource Proceedings 2014 (1): 477–82. https://doi.org/10.4071/isom-WA42.

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