Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:20372/feed
Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Automated Wirepull Testing – Parallelogram of Forces-Real Time Application

Richard C. Garcia, Josef Sedlmair (F&K Delvotec),
Automatic bond pull testingF&K Delvotec 5600 autobond pull testernon-destruct wirepull testing and destructive wirebond pull testingMiL-STD-883 Method 2011.7 bond strength (Destructive Bond Pull Test)MiL-STD-883 Method 2023.5 Nondestructive Bond Pull
https://doi.org/10.4071/isom-2013-TP45
IMAPSource Conference Papers
Garcia, Richard C., and Josef Sedlmair (F&K Delvotec). 2013. “Automated Wirepull Testing – Parallelogram of Forces-Real Time Application.” IMAPSource Proceedings 2013 (1): 331–35. https:/​/​doi.org/​10.4071/​isom-2013-TP45.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system