Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications
Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications
Saums, Dave, Tim Jensen, Carol Gowans, Seth Homer, and Ron Hunadi. 2018. “Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications.” IMAPSource Proceedings 2018 (1): 613–18. https://doi.org/10.4071/2380-4505-2018.1.000613.