Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration
Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration
Chien, Chun-Hsien, Ching-Kuan Lee, Hsun Yu, Chang-Chih Liu, Peng-Shu Chen, Heng-Chieh Chien, Jen-Hau Cheng, et al. 2013. “Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration.” IMAPSource Proceedings 2013 (1): 618–24. https://doi.org/10.4071/isom-2013-WP12.