Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration

Chun-Hsien Chien; Ching-Kuan Lee; Hsun Yu; Chang-Chih Liu; Peng-Shu Chen; Heng-Chieh Chien; Jen-Hau Cheng; Li-Ling Liao; Ming-Ji Dai; Yu-Min Lin; Chau-Jie Zhan; Cheng-Ta Ko; Wei-Chung Lo; Yung Jean (Rachel) Lu

doi:10.4071/isom-2013-WP12

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Chien, Chun-Hsien, Ching-Kuan Lee, Hsun Yu, Chang-Chih Liu, Peng-Shu Chen, Heng-Chieh Chien, Jen-Hau Cheng, et al. 2013. “Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration.” IMAPSource Proceedings 2013 (1): 618–24. https://doi.org/10.4071/isom-2013-WP12.

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