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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration

Chun-Hsien Chien, Ching-Kuan Lee, Hsun Yu, Chang-Chih Liu, Peng-Shu Chen, Heng-Chieh Chien, Jen-Hau Cheng, Li-Ling Liao, Ming-Ji Dai, Yu-Min Lin, Chau-Jie Zhan, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean (Rachel) Lu,
TGV(Through-Glass Via)glass interposerTSV(Through- Silicon Via)Silicon interposer3DICSiP
https://doi.org/10.4071/isom-2013-WP12
IMAPSource Conference Papers
Chien, Chun-Hsien, Ching-Kuan Lee, Hsun Yu, Chang-Chih Liu, Peng-Shu Chen, Heng-Chieh Chien, Jen-Hau Cheng, et al. 2013. “Performance and Process Comparison between Glass and Si Interposer for 3D-IC Integration.” IMAPSource Proceedings 2013 (1): 618–24. https:/​/​doi.org/​10.4071/​isom-2013-WP12.
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