Fine Pitch 3D Dispensable Electrical Interconnects for System In Package Solutions

Jeff S. Leal; Suzette K. Pangrle; Charles Whyte; Keith Barrie; Jeff Leff; Scott McGrath; Gerardo Ayala

doi:10.4071/isom-2010-WP1-Paper5

Leal, Jeff S., Suzette K. Pangrle, Charles Whyte, Keith Barrie, Jeff Leff, Scott McGrath, and Gerardo Ayala. 2010. “Fine Pitch 3D Dispensable Electrical Interconnects for System In Package Solutions.” IMAPSource Proceedings 2010 (1): 559–65. https://doi.org/10.4071/isom-2010-WP1-Paper5.

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