Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capability
Miyazawa, Risa, Eiji Nakamura, Chinami Marushima, Toyohiro Aoki, and Takashi Hisada. 2020. “Simulation and Experimental Study on IMS (Injection Molded Solder) Bumping with Expanded Resist Patterning for Reinforcement of Fine-Pitch Capability.” IMAPSource Proceedings 2020 (1): 119–24. https://doi.org/10.4071/2380-4505-2020.1.000119.