Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
FCCSP IMC Growth under Reliability Stress follow Automotive Criteria
Wei-Wei Liu (Xenia)
,
Berdy Weng
,
Jerry Li
,
CK Yeh
,
Automotive
FCCSP
Intermetallic
Cu Pillar
Pb-Free Bump
•
https://doi.org/10.4071/2380-4505-2018.1.000129
IMAPSource Conference Papers
Liu (Xenia), Wei-Wei, Berdy Weng, Jerry Li, and CK Yeh. 2018. “FCCSP IMC Growth under Reliability Stress Follow Automotive Criteria.”
IMAPSource Proceedings
2018 (1): 129–34.
https://doi.org/10.4071/2380-4505-2018.1.000129
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats