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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

FCCSP IMC Growth under Reliability Stress follow Automotive Criteria

Wei-Wei Liu (Xenia), Berdy Weng, Jerry Li, CK Yeh,
AutomotiveFCCSPIntermetallicCu PillarPb-Free Bump
https://doi.org/10.4071/2380-4505-2018.1.000129
IMAPSource Conference Papers
Liu (Xenia), Wei-Wei, Berdy Weng, Jerry Li, and CK Yeh. 2018. “FCCSP IMC Growth under Reliability Stress Follow Automotive Criteria.” IMAPSource Proceedings 2018 (1): 129–34. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000129.
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