Vol. 2018, Issue 1, 2018October 01, 2018 EDT
A numerical study on mitigation of flying dies in compression molding of microelectronic packages
A numerical study on mitigation of flying dies in compression molding of microelectronic packages
Dreissigacker, Marc, Ole Hoelck, Joerg Bauer, Tanja Braun, Karl-Friedrich Becker, Martin Schneider-Ramelow, and Klaus-Dieter Lang. 2018. “A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages.” IMAPSource Proceedings 2018 (1): 355–60. https://doi.org/10.4071/2380-4505-2018.1.000355.