A numerical study on mitigation of flying dies in compression molding of microelectronic packages

Marc Dreissigacker; Ole Hoelck; Joerg Bauer; Tanja Braun; Karl-Friedrich Becker; Martin Schneider-Ramelow; Klaus-Dieter Lang

doi:10.4071/2380-4505-2018.1.000355

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Dreissigacker, Marc, Ole Hoelck, Joerg Bauer, Tanja Braun, Karl-Friedrich Becker, Martin Schneider-Ramelow, and Klaus-Dieter Lang. 2018. “A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages.” IMAPSource Proceedings 2018 (1): 355–60. https://doi.org/10.4071/2380-4505-2018.1.000355.

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