Vol. 2010, Issue 1, 2010January 01, 2010 EDT
High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow Underfill
High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow Underfill
Lee, Sangil, and Daniel F. Baldwin. 2010. “High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow Underfill.” IMAPSource Proceedings 2010 (1): 798–805. https://doi.org/10.4071/isom-2010-THA2-Paper3.
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