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Symposium Proceedings
Vol. 2011, Issue 1, 2011
January 01, 2011 EDT
Properties and Reliability of Silicon Nitride Substrates with AMB Copper Conductor
Böhm Gaby
,
Brunner Dieter
,
Sichert Ina
,
Pönicke Andreas
,
Schilm Jochen
,
AMB
Si3N4
thermal conductivity
reliability
copper conductor lines
•
https://doi.org/10.4071/isom-2011-WP4-Paper1
IMAPSource Conference Papers
Gaby, Böhm, Brunner Dieter, Sichert Ina, Pönicke Andreas, and Schilm Jochen. 2011. “Properties and Reliability of Silicon Nitride Substrates with AMB Copper Conductor.”
IMAPSource Proceedings
2011 (1): 777–84.
https://doi.org/10.4071/isom-2011-WP4-Paper1
.
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