Development and usability study of pre-applied inter chip fill for 3D-IC

Kan Takeshita; Makoto Ikemoto; Masaya Sugiyama; Hidehiro Yamamoto; Hideki Kiritani; Yashuhiro Kawase

doi:10.4071/isom-2015-THA25

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Takeshita, Kan, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani, and Yashuhiro Kawase. 2015. “Development and Usability Study of Pre-Applied Inter Chip Fill for 3D-IC.” IMAPSource Proceedings 2015 (1): 589–93. https://doi.org/10.4071/isom-2015-THA25.

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