Development and usability study of pre-applied inter chip fill for 3D-IC

Takeshita, Kan, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani, and Yashuhiro Kawase. 2015. “Development and Usability Study of Pre-Applied Inter Chip Fill for 3D-IC.” IMAPSource Proceedings 2015 (1): 589–93. https:/​/​doi.org/​10.4071/​isom-2015-THA25.