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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

Development and usability study of pre-applied inter chip fill for 3D-IC

Kan Takeshita, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani, Yashuhiro Kawase,
3D-IC Dispensability High thermal Inter chip fill Pre-applied process Void-free
• https://doi.org/10.4071/isom-2015-THA25
IMAPSource Conference Papers
Takeshita, Kan, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani, and Yashuhiro Kawase. 2015. “Development and Usability Study of Pre-Applied Inter Chip Fill for 3D-IC.” IMAPSource Proceedings 2015 (1): 589–93. https://doi.org/10.4071/isom-2015-THA25.
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