Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing
Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing
Singh, Inderjit, Shin Low, Syu Fu Song, Chen Shih Jung, Lin Ming San, Ivy Qin, Cuong Huynh, et al. 2012. “Pd-Coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing.” IMAPSource Proceedings 2012 (1): 396–404. https://doi.org/10.4071/isom-2012-TP42.