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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing

Inderjit Singh, Shin Low, Syu Fu Song, Chen Shih Jung, Lin Ming San, Ivy Qin, Cuong Huynh, Horst Clauberg, Son Truong Nguyen, Bob Chylak, Hui Xu, Viola L. Acoff,
Pd-coatedWire BondingDevice DesignProcess OptimizationTestingpcccu wireau wire
https://doi.org/10.4071/isom-2012-TP42
IMAPSource Conference Papers
Singh, Inderjit, Shin Low, Syu Fu Song, Chen Shih Jung, Lin Ming San, Ivy Qin, Cuong Huynh, et al. 2012. “Pd-Coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing.” IMAPSource Proceedings 2012 (1): 396–404. https:/​/​doi.org/​10.4071/​isom-2012-TP42.
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