Pd-coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing

Inderjit Singh; Shin Low; Syu Fu Song; Chen Shih Jung; Lin Ming San; Ivy Qin; Cuong Huynh; Horst Clauberg; Son Truong Nguyen; Bob Chylak; Hui Xu; Viola L. Acoff

doi:10.4071/isom-2012-TP42

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Singh, Inderjit, Shin Low, Syu Fu Song, Chen Shih Jung, Lin Ming San, Ivy Qin, Cuong Huynh, et al. 2012. “Pd-Coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing.” IMAPSource Proceedings 2012 (1): 396–404. https://doi.org/10.4071/isom-2012-TP42.

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