Singh, Inderjit, Shin Low, Syu Fu Song, Chen Shih Jung, Lin Ming San, Ivy Qin, Cuong Huynh, et al. 2012. “Pd-Coated Cu Wire Bonding Reliability Requirement for Device Design, Process Optimization and Testing.”
IMAPSource Proceedings 2012 (1): 396–404.
https://doi.org/10.4071/isom-2012-TP42.