Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Long-term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 μm or 60 μm Diameter Employing ENIG Surface Finish on Both Chip and Substrate Side
Long-term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 μm or 60 μm Diameter Employing ENIG Surface Finish on Both Chip and Substrate Side
Gorywoda, Marek, Rainer Dohle, Stefan Härter, Andreas Wirth, Jörg Goßler, and Jörg Franke. 2013. “Long-Term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 Μm or 60 Μm Diameter Employing ENIG Surface Finish on Both Chip and Substrate Side.” IMAPSource Proceedings 2013 (1): 523–30. https://doi.org/10.4071/isom-2013-WA42.