Vol. 2015, Issue 1, 2015October 01, 2015 EDT
A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS
A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS
Bhattacharya, Swapan K., Fei Xie, Han Wu, Kelley Hodge, Keck Pathammavong, Paul N. Houston, Daniel F. Baldwin, and Albert Giorgini. 2015. “A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS.” IMAPSource Proceedings 2015 (1): 627–32. https://doi.org/10.4071/isom-2015-THA36.
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