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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Achieving Low Voiding with Lead Free Solder Paste for Power Devices

Pierino I Zappella, Saeed Sedehi, Robert Hizon, Adrienne D. Williams,
solder paste95Sn5Agvacuum and pressure reflowfluxvoid freesolder reflow
https://doi.org/10.4071/isom-2016-THP41
IMAPSource Conference Papers
Zappella, Pierino I, Saeed Sedehi, Robert Hizon, and Adrienne D. Williams. 2016. “Achieving Low Voiding with Lead Free Solder Paste for Power Devices.” IMAPSource Proceedings 2016 (1): 618–23. https:/​/​doi.org/​10.4071/​isom-2016-THP41.
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