Achieving Low Voiding with Lead Free Solder Paste for Power Devices

Pierino I Zappella; Saeed Sedehi; Robert Hizon; Adrienne D. Williams

doi:10.4071/isom-2016-THP41

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Zappella, Pierino I, Saeed Sedehi, Robert Hizon, and Adrienne D. Williams. 2016. “Achieving Low Voiding with Lead Free Solder Paste for Power Devices.” IMAPSource Proceedings 2016 (1): 618–23. https://doi.org/10.4071/isom-2016-THP41.

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