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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Achieving Low Voiding with Lead Free Solder Paste for Power Devices
Pierino I Zappella
,
Saeed Sedehi
,
Robert Hizon
,
Adrienne D. Williams
,
solder paste
95Sn5Ag
vacuum and pressure reflow
flux
void free
solder reflow
•
https://doi.org/10.4071/isom-2016-THP41
IMAPSource Conference Papers
Zappella, Pierino I, Saeed Sedehi, Robert Hizon, and Adrienne D. Williams. 2016. “Achieving Low Voiding with Lead Free Solder Paste for Power Devices.”
IMAPSource Proceedings
2016 (1): 618–23.
https://doi.org/10.4071/isom-2016-THP41
.
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