Achieving Low Voiding with Lead Free Solder Paste for Power Devices

Zappella, Pierino I, Saeed Sedehi, Robert Hizon, and Adrienne D. Williams. 2016. “Achieving Low Voiding with Lead Free Solder Paste for Power Devices.” IMAPSource Proceedings 2016 (1): 618–23. https:/​/​doi.org/​10.4071/​isom-2016-THP41.