Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Achieving Low Voiding with Lead Free Solder Paste for Power Devices
Achieving Low Voiding with Lead Free Solder Paste for Power Devices
Zappella, Pierino I, Saeed Sedehi, Robert Hizon, and Adrienne D. Williams. 2016. “Achieving Low Voiding with Lead Free Solder Paste for Power Devices.” IMAPSource Proceedings 2016 (1): 618–23. https://doi.org/10.4071/isom-2016-THP41.