Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration
Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration
Li, Zhaozhi, Brian J. Lewis, Paul N. Houston, Daniel F. Baldwin, Eugene A. Stout, Theodore G. Tessier, and John L. Evans. 2010. “Wafer Level Assembly Technique Development for Fine Pitch Flip Chip 3D Die-to-Wafer Integration.” IMAPSource Proceedings 2010 (1): 548–53. https://doi.org/10.4071/isom-2010-WP1-Paper3.