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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Characterizing and solving imaging challenges in thick resists for wafer and panel based lithography applications
James E. Webb
,
Roger McCleary
,
Projection lithography
stepper
thick films
redistribution layer (RDL)
via
photoresist modeling
•
https://doi.org/10.4071/isom-2016-TP22
IMAPSource Conference Papers
Webb, James E., and Roger McCleary. 2016. “Characterizing and Solving Imaging Challenges in Thick Resists for Wafer and Panel Based Lithography Applications.”
IMAPSource Proceedings
2016 (1): 38–43.
https://doi.org/10.4071/isom-2016-TP22
.
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