Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect
Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch Interconnect
Marsan-Loyer, C., D. Danovitch, and N. Boyer. 2016. “Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-Fine Pitch Interconnect.” IMAPSource Proceedings 2016 (1): 54–59. https://doi.org/10.4071/isom-2016-TP25.