Vol. 2016, Issue 1, 2016October 01, 2016 EDT
The Impact of Stencil Printing Upon Assembly & Reliability Of 0.3mm Pitch CSP Components
The Impact of Stencil Printing Upon Assembly & Reliability Of 0.3mm Pitch CSP Components
Whitmore, Mark, and Jeff Schake. 2016. “The Impact of Stencil Printing Upon Assembly & Reliability Of 0.3mm Pitch CSP Components.” IMAPSource Proceedings 2016 (1): 667–74. https://doi.org/10.4071/isom-2016-THP55.