Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology.
Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology.
Sieroshtan, V., G. Sevskiy, P. Komakha, O. Aleksieiev, A. Burygin, O. Chayka, O. Ruban, et al. 2012. “Novel Ultra-Compact Quad-Band System-in-Package (SiP) Module with IC Embedded in Substrate Based on SESUB Technology.” IMAPSource Proceedings 2012 (1): 1131–34. https://doi.org/10.4071/isom-2012-THP41.