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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability

Youngtak Lee, Doug Link,
Design of experimentsflip chiplead freesurface mount devicessystem-in-package
https://doi.org/10.4071/isom-2016-TP53
IMAPSource Conference Papers
Lee, Youngtak, and Doug Link. 2016. “Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability.” IMAPSource Proceedings 2016 (1): 111–16. https:/​/​doi.org/​10.4071/​isom-2016-TP53.
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