Advanced lithography and electroplating approach to form high-aspect ratio copper pillars

Keith Best; Roger McCleary; Richard Hollman; Phillip Holmes

doi:10.4071/isom-2015-THP23

Best, Keith, Roger McCleary, Richard Hollman, and Phillip Holmes. 2015. “Advanced Lithography and Electroplating Approach to Form High-Aspect Ratio Copper Pillars.” IMAPSource Proceedings 2015 (1): 793–98. https://doi.org/10.4071/isom-2015-THP23.

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Advanced lithography and electroplating approach to form high-aspect ratio copper pillars

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