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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
Advanced lithography and electroplating approach to form high-aspect ratio copper pillars
Keith Best
,
Roger McCleary
,
Richard Hollman
,
Phillip Holmes
,
Advanced Packaging
2.5D
3D
TSV
High Aspect Ratio Cu Pillar
Stepper
Panel
Si Interposer
thick resist
dry-film resist
sidewall angle
Through Silicon Via
Electro-Plating
ECD
Cu plating
•
https://doi.org/10.4071/isom-2015-THP23
IMAPSource Conference Papers
Best, Keith, Roger McCleary, Richard Hollman, and Phillip Holmes. 2015. “Advanced Lithography and Electroplating Approach to Form High-Aspect Ratio Copper Pillars.”
IMAPSource Proceedings
2015 (1): 793–98.
https://doi.org/10.4071/isom-2015-THP23
.
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