Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch Design
Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch Design
Chu, Min, Jie Chen, Abidur Rahman, and Rajen Murugan. 2020. “Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch Design.” IMAPSource Proceedings 2020 (1): 15–20. https://doi.org/10.4071/2380-4505-2020.1.000015.