Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Novel Mold-free Fan-out Wafer Level Package using Silicon Wafer
Novel Mold-free Fan-out Wafer Level Package using Silicon Wafer
Kelkar, Amit, Vivek Sridharan, Khanh Tran, Kiyoko Ikeuchi, Anu Srivastava, Viren Khandekar, and Ricky Agrawal. 2016. “Novel Mold-Free Fan-out Wafer Level Package Using Silicon Wafer.” IMAPSource Proceedings 2016 (1): 410–14. https://doi.org/10.4071/isom-2016-THA23.