Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder

Takashi Hisada; Toyohiro Aoki; Eiji Nakamura; Sayuri Kohara; Hiroyuki Mori

doi:10.4071/2380-4505-2019.1.000103

Hisada, Takashi, Toyohiro Aoki, Eiji Nakamura, Sayuri Kohara, and Hiroyuki Mori. 2019. “Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder.” IMAPSource Proceedings 2019 (1): 103–9. https://doi.org/10.4071/2380-4505-2019.1.000103.

View more stats