Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder
Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder
Hisada, Takashi, Toyohiro Aoki, Eiji Nakamura, Sayuri Kohara, and Hiroyuki Mori. 2019. “Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded Solder.” IMAPSource Proceedings 2019 (1): 103–9. https://doi.org/10.4071/2380-4505-2019.1.000103.