Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Assembly challenges with Flip Chip multi-die and interposer-based SiP Modules
Assembly challenges with Flip Chip multi-die and interposer-based SiP Modules
Singh, Akhilesh K, Kevin M Sullivan, George R Leal, and Tony Gong. 2019. “Assembly Challenges with Flip Chip Multi-Die and Interposer-Based SiP Modules.” IMAPSource Proceedings 2019 (1): 1–5. https://doi.org/10.4071/2380-4505-2019.1.000001.