Assembly challenges with Flip Chip multi-die and interposer-based SiP Modules

Akhilesh K Singh; Kevin M Sullivan; George R Leal; Tony Gong

doi:10.4071/2380-4505-2019.1.000001

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Singh, Akhilesh K, Kevin M Sullivan, George R Leal, and Tony Gong. 2019. “Assembly Challenges with Flip Chip Multi-Die and Interposer-Based SiP Modules.” IMAPSource Proceedings 2019 (1): 1–5. https://doi.org/10.4071/2380-4505-2019.1.000001.

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